The over-molding technology has become central within the DTI.
Often the need to seal wiring and make it immune to external factors forcing our client to deal with different steps. The investment made by the company has enabled the integration in the production process of "HOT MELT" technology.
The first phase has seen the use of co-molding alongside the wiring, at a later stage this was also used to seal other electronic boards exposed to moisture, or any external factor.
The konw how developed over the years on this technology, ensures a quick response to the customer in the product development phase and feasibility.